Holly Springs, NC, United States of America

Joseph Marco Longo


Average Co-Inventor Count = 2.6

ph-index = 3

Forward Citations = 261(Granted Patents)


Company Filing History:


Years Active: 2009-2012

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3 patents (USPTO):Explore Patents

Title: Joseph Marco Longo: Innovator in Semiconductor Technology

Introduction

Joseph Marco Longo is a notable inventor based in Holly Springs, NC (US). He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on enhancing the efficiency and functionality of semiconductor devices.

Latest Patents

One of Longo's latest patents is for a "Shielding for a semiconductor package." This invention involves a semiconductor device with a substrate, where a first die is electrically attached to the substrate. A shield spacer is utilized, which has a first and second surface, with the second surface attached to the first die. Wirebonds connect the shield spacer to the substrate, and a mold compound encapsulates the first die, shield spacer, and wirebonds.

Another significant patent is the "Stacked redistribution layer (RDL) die assembly package." This package includes a substrate with a first level RDL die assembly mounted to it, along with a second level RDL die assembly mounted to the first. The first level features a die with bond pads and a fan-out support, while the second level mirrors this structure, enhancing the overall design and functionality of the semiconductor package.

Career Highlights

Joseph Marco Longo is currently employed at Amkor Technology, Inc., where he continues to innovate in semiconductor packaging solutions. His work has been instrumental in advancing the technology used in modern electronic devices.

Collaborations

Longo has collaborated with notable coworkers, including Christopher Marc Scanlan and Roger D St Amand. Their combined expertise contributes to the innovative environment at Amkor Technology, Inc.

Conclusion

Joseph Marco Longo is a prominent figure in the semiconductor industry, with a focus on developing advanced packaging solutions. His patents reflect his commitment to innovation and excellence in technology.

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