Amkor Technology, Inc.

Joseph Marco Longo

Christopher Marc Scanlan

Robert Francis Darveaux

Roger D St Amand

Nozad Karim

Lee John Smith

Jong Ok Chun

Jingkun Mao

A semiconductor device has a substrate. A first die is electrically attached to a first surface of the substrate. A shield spacer having a first and second surface is provided wherein the second surface of the shield spacer is attached to a first surface of the first die. A plurality of wirebonds are attached to the shield spacer and to the substrate. A mold compound is provided for encapsulating the first die, the shield spacer, and the wirebonds.

Shielding for a semiconductor package

A stacked redistribution layer (RDL) die assembly package includes a substrate, a first level RDL die assembly mounted to the substrate and a second level RDL die assembly mounted to the first level RDL die assembly. The first level RDL die assembly includes a first die comprising bond pads, a first fan out support extending outwardly from sides of the first die, and first traces electrically connected to the bond pads, the first traces being supported by the first fan out support. Similarly, the second level RDL die assembly includes a second die comprising bond pads, a second fan out support extending outwardly from sides of the second die, and second traces electrically connected to the bond pads of the second die, the second traces being supported by the second fan out support.

Stacked redistribution layer (RDL) die assembly package

Growing community of inventors

Holly Springs, NC, United States of America

Joseph Marco Longo