Company Filing History:
Years Active: 2011-2012
Title: Innovations by Jingkun Mao
Introduction
Jingkun Mao is an accomplished inventor based in Maricopa, AZ (US). He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on enhancing the performance and reliability of semiconductor packages.
Latest Patents
One of Jingkun Mao's latest patents is titled "Shielding for a semiconductor package." This invention involves a semiconductor device that features a substrate with a first die electrically attached to its surface. A shield spacer is integrated into the design, providing enhanced protection for the semiconductor components. The shield spacer is attached to the first die, and wirebonds connect it to the substrate, all encapsulated by a mold compound.
Another notable patent is "System and method to provide RF shielding for a MEMS microphone package." This innovation includes a substrate with an opening, around which a first RF shield is formed. A first die is positioned over the opening, ensuring effective RF shielding for the microphone package.
Career Highlights
Jingkun Mao is currently employed at Amkor Technology, Inc., a leading company in semiconductor packaging and testing. His expertise in semiconductor technology has allowed him to contribute to various innovative projects within the company.
Collaborations
Jingkun has collaborated with notable coworkers, including Nozad Karim and Roger D St Amand. Their combined efforts have led to advancements in semiconductor technology and improved product offerings.
Conclusion
Jingkun Mao's contributions to semiconductor technology through his patents and work at Amkor Technology, Inc. highlight his role as an influential inventor in the industry. His innovations continue to shape the future of semiconductor packaging and performance.