Amkor Technology, Inc.

Jingkun Mao

Nozad Karim

Robert Francis Darveaux

Roger D St Amand

Lee John Smith

Jong Ok Chun

Bob Shih Wei Kuo

Joseph Marco Longo

A semiconductor device has a substrate. A first die is electrically attached to a first surface of the substrate. A shield spacer having a first and second surface is provided wherein the second surface of the shield spacer is attached to a first surface of the first die. A plurality of wirebonds are attached to the shield spacer and to the substrate. A mold compound is provided for encapsulating the first die, the shield spacer, and the wirebonds.

Shielding for a semiconductor package

A semiconductor package has a substrate. An opening is formed through the substrate. A first RF shield is formed around a perimeter of the opening. A first die is attached to the first surface of the substrate and positioned over the opening.

System and method to provide RF shielding for a MEMS microphone package

Growing community of inventors

Maricopa, AZ, United States of America

Jingkun Mao