Jong Ok Chun

Title: Innovations of Jong Ok Chun

Introduction

Jong Ok Chun is a notable inventor based in Chandler, AZ, with a remarkable portfolio of eight patents. Her contributions to the field of electronic component packaging have significantly advanced the technology used in various applications.

Latest Patents

One of her latest patents is the Shielded Electronic Component Package. This innovative electronic component package includes a substrate and an electronic component mounted to the substrate, which features a bond pad. A first antenna terminal is electrically connected to the bond pad, and this terminal is also connected to a second antenna terminal of the substrate. The package body encloses the electronic component and has a principal surface where an antenna is formed by applying an electrically conductive coating. An embedded interconnect extends through the package body, connecting the substrate to the principal surface and electrically linking the second antenna terminal to the antenna. This method of applying an electrically conductive coating simplifies the manufacturing process, thereby minimizing overall package costs. Additionally, the thin design of the antenna contributes to a reduced package size.

Career Highlights

Jong Ok Chun has worked with prominent companies in the industry, including Amkor Technology, Inc. and Amkor Technology Singapore Holding Pte. Ltd. Her experience in these organizations has allowed her to refine her skills and contribute to significant advancements in electronic packaging technology.

Collaborations

Throughout her career, she has collaborated with talented individuals such as Nozad Karim and Richard Chen, enhancing her innovative projects and expanding her professional network.

Conclusion

Jong Ok Chun's work in electronic component packaging exemplifies her dedication to innovation and her impact on the industry. Her patents reflect her expertise and commitment to advancing technology in meaningful ways.