Amkor Technology, Inc.

Amkor Technology Singapore Holding Pte. Ltd.

Amkor Technology Singapore Pte. Ltd.

Jong Ok Chun

Nozad Karim

Michael G Kelly

Richard Chen

Giuseppe Selli

Robert Francis Darveaux

Roger D St Amand

Lee John Smith

Ruben Fuentes

Christopher Scanlan

Joseph Marco Longo

Jingkun Mao

An electronic component package includes a substrate and an electronic component mounted to the substrate, the electronic component including a bond pad. A first antenna terminal is electrically connected to the bond pad, the first antenna terminal being electrically connected to a second antenna terminal of the substrate. A package body encloses the electronic component, the package body having a principal surface. An antenna is formed on the principal surface by applying an electrically conductive coating. An embedded interconnect extends through the package body between the substrate and the principal surface and electrically connects the second antenna terminal to the antenna. Applying an electrically conductive coating to form the antenna is relatively simple thus minimizing the overall package manufacturing cost. Further, the antenna is relatively thin thus minimizing the overall package size.

Shielded electronic component package

Shield lid interconnect package and method

Top feature package and method

A semiconductor device has a substrate. A first die is electrically attached to a first surface of the substrate. A shield spacer having a first and second surface is provided wherein the second surface of the shield spacer is attached to a first surface of the first die. A plurality of wirebonds are attached to the shield spacer and to the substrate. A mold compound is provided for encapsulating the first die, the shield spacer, and the wirebonds.

Shielding for a semiconductor package

A semiconductor device has a substrate having a plurality of metal traces. At least one electronic component is electrically coupled to a first surface of the substrate. A mold compound is used for encapsulating portions of the electronic component and the first surface of the substrate, wherein a portion of the mold compound is removed around at least one side of the electronic component. A conductive coating is applied to the mold compound and an area where the portion of the mold compound is removed.

System and method for RF shielding of a semiconductor package

Growing community of inventors

Chandler, AZ, United States of America

Jong Ok Chun