The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2012
Filed:
Jul. 14, 2009
Applicants:
Ruben Fuentes, Gilbert, AZ (US);
Christopher Scanlan, Hellerup, DK;
Jong Chun, Chandler, AZ (US);
Inventors:
Assignee:
Amkor Technology, Inc., Chandler, AZ (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/52 (2006.01); H01L 293/40 (2006.01); H01L 23/48 (2006.01); H01L 23/28 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor device has a substrate having a plurality of metal traces. At least one electronic component is electrically coupled to a first surface of the substrate. A mold compound is used for encapsulating portions of the electronic component and the first surface of the substrate, wherein a portion of the mold compound is removed around at least one side of the electronic component. A conductive coating is applied to the mold compound and an area where the portion of the mold compound is removed.