The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 11, 2007
Filed:
Feb. 20, 2004
Michael Warner, San Jose, CA (US);
Lee Smith, Chandler, AZ (US);
Belgacem Haba, Cupertino, CA (US);
Glenn Urbish, Coral Springs, FL (US);
Masud Beroz, Livermore, CA (US);
Teck-gyu Kang, San Jose, CA (US);
Michael Warner, San Jose, CA (US);
Lee Smith, Chandler, AZ (US);
Belgacem Haba, Cupertino, CA (US);
Glenn Urbish, Coral Springs, FL (US);
Masud Beroz, Livermore, CA (US);
Teck-Gyu Kang, San Jose, CA (US);
Tessera, Inc., San Jose, CA (US);
Abstract
A packaged semiconductor chip includes features such as a chip carrier having a large thermal conductor which can be solder-bonded to a circuit panel so as to provide enhanced thermal conductivity to the circuit panel and electromagnetic shielding and a conductive enclosure which partially or completely surrounds the packaged chip to provide additional heat dissipation and shielding. The packaged unit may include both an active semiconductor chip and a passive element, desirably in the form of a chip, which includes resistors and capacitors. Inductors may be provided in whole or in part on the chip carrier.