logo

For the Inventor, By the Inventor

Tanjung Bungah, Malaysia

Lai Guan Tang

This inventor holds 29 USPTO granted patents and 14 published patent applications, primarily in Integrated Circuit Design. Top assignees: Intel Corporation, Altera Corporation. Active years: 2014-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Lai Guan Tang. Retrieved from https://idiyas.com/inventor/lai-guan-tang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 29 

% Patents Active = 89.7

Average Co-Inventor Count = 3.4

ph-index = 3

Forward Citations = 41(Granted Patents)


Location History:

  • Bayan Lepas, MY (2019)
  • Penang, MY (2014 - 2024)
  • Tanjung Bungah, MY (2019 - 2024)

Company Filing History:

goldMedal18 out of 56,290 
 
Intel Corporation
 patents
silverMedal11 out of 4,331 
 
Altera Corporation
 patents

Years Active: 2014-2026

Loading Chart...
Areas of Expertise:
Die-to-Die Power Delivery
Integrated Circuit Device
Dynamic Power Management
Thermal Management
Configurable Interface Circuits
Clock Signal Transmission
Network-on-Chip
Modular Periphery Tile
High-Speed Core Interconnect
Fabric Die Interconnect
Pulse-Width Modulation
Scalable Micro Bumps
29 patents (USPTO):Explore Patents
1. 12745622 - Die-to-die power delivery (2026-09-22),
2. 12633925 - Three-dimensional columnar input-output (IO) circuitry for integrated circuit device (2026-05-19),
3. 12525980 - Systems and methods for dynamic power and thermal management for programmable logic devices (2026-01-13),
4. 12425030 - Systems and methods for configurable interface circuits (2025-09-23),
5. 12394713 - Fabric die to fabric die interconnect for modularized integrated circuit devices (2025-08-19),
6. 12334449 - Selective use of different advanced interface bus with electronic chips (2025-06-17),
7. 12153866 - Modular periphery tile for integrated circuit device (2024-11-26),
8. 12026008 - Techniques for clock signal transmission in integrated circuits and interposers (2024-07-02),
9. 12009298 - Fabric die to fabric die interconnect for modularized integrated circuit devices (2024-06-11),
10. 11726932 - Network-on-chip for inter-die and intra-die communication in modularized integrated circuit devices (2023-08-15),
11. 11714941 - Modular periphery tile for integrated circuit device (2023-08-01),
12. 11670589 - Fabric die to fabric die interconnect for modularized integrated circuit devices (2023-06-06),
13. 11669472 - Frequency translation circuitry for an interconnection in an active interposer of a semiconductor package (2023-06-06),
14. 11621713 - High-speed core interconnect for multi-die programmable logic devices (2023-04-04),
15. 11528029 - Apparatus to synchronize clocks of configurable integrated circuit dies through an interconnect bridge (2022-12-13),

Title: Innovations and Contributions of Lai Guan Tang

Introduction

Lai Guan Tang, located in Tanjung Bungah, Malaysia, is a prominent inventor known for his significant contributions to the field of integrated circuit design. With a remarkable portfolio of 23 patents, Tang has demonstrated a strong commitment to advancing technology through innovative solutions.

Latest Patents

One of Lai Guan Tang's latest patents is focused on a Modular Periphery Tile for Integrated Circuit Devices. This invention seeks to enhance the scalability of integrated circuit systems by disaggregating periphery intellectual property (IP) circuitry into modular tiles, allowing for flexible configurations that can be installed as modules. This integration can include a first die, featuring programmable fabric circuitry, and a second die that consists of the periphery IP tile, interconnected via a modular interface.

Another notable patent addresses techniques for clock signal transmission in integrated circuits and interposers. This invention involves specialized input and output buffer circuits that manage signal transmission efficiently during varying operational modes. By employing control signals, the integrated circuit die can effectively handle input signals from conductive bumps and output signals back to them, ensuring optimal performance during active communication periods.

Career Highlights

Lai Guan Tang has held prestigious positions at major technology firms, including Intel Corporation and Altera Corporation. His experience at these leading companies has significantly influenced his approach to invention and innovation within the semiconductor industry. His technical expertise is complemented by his robust patent portfolio, reflecting his deep understanding of integrated circuit technology.

Collaborations

Throughout his career, Lai Guan Tang has worked alongside notable professionals such as Chee Hak Teh and Ankireddy Nalamalpu. These collaborations have fostered an environment of shared knowledge and innovation, enabling the development of cutting-edge technologies that address the evolving needs of the industry.

Conclusion

Lai Guan Tang's contributions to the field of integrated circuits through his extensive patent portfolio and collaborations with industry leaders underline his role as an influential inventor. His work continues to push the boundaries of technology, paving the way for advancements that benefit various applications in integrated circuit systems.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…