The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2026
Filed:
Apr. 01, 2022
Applicant:
Altera Corporation, San Jose, CA (US);
Inventors:
Lai Guan Tang, Tanjung Bungah, MY;
Ankireddy Nalamalpu, Portland, OR (US);
Mahesh K. Kumashikar, Bangalore, IN;
Atul Maheshwari, Portland, OR (US);
Assignee:
Altera Corporation, San Jose, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 21/85 (2013.01); G06F 11/07 (2006.01); G06F 21/60 (2013.01); G06F 21/78 (2013.01);
U.S. Cl.
CPC ...
G06F 21/85 (2013.01); G06F 11/0772 (2013.01); G06F 21/602 (2013.01); G06F 21/78 (2013.01);
Abstract
Systems or methods of the present disclosure may provide a semiconductor device including a die of a multi-die package including encryption circuitry to receive data and to encrypt the data to generate encrypted data; and a connection interface to transmit the encrypted data over a die-to-die interconnect to a second die.
Tang, Lai. (2026). Security on die-to-die interconnect (U.S. Patent No. 12762292). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12762292
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile