The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 17, 2025

Filed:

Sep. 25, 2020
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Dheeraj Subbareddy, Portland, OR (US);

Ankireddy Nalamalpu, Portland, OR (US);

Lai Guan Tang, Tanjung Bungah, MY;

Mahesh K. Kumashikar, Bangalore, IN;

Assignee:

Altera Corporation, San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 23/14 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 23/5386 (2013.01); H01L 23/145 (2013.01); H01L 23/5383 (2013.01); H01L 24/16 (2013.01); H01L 25/0655 (2013.01); H01L 2224/16225 (2013.01);
Abstract

A digitally communicative circuit may use standardized interfaces for connection and communication with other circuit components. Such digitally communicative circuit may benefit from using wider variety of interconnect schemes with the respective interfaces for transmission and reception of data. Some chiplets may communicate using a high data bandwidth interface while other chiplets may communicate using interfaces with lower data bandwidth. Alternate interface is introduced that may facilitate scaled communication with Advanced Interface Bus 2.0 without translation circuitry and with different data bandwidth.


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