Santa Clara, CA, United States of America

Kyuil Cho

This inventor holds 32 USPTO granted patents and 8 published patent applications and 1 EPO patent. Top assignee: Applied Materials, Inc.. Active years: 2019-2025.

USPTO Granted Patents = 32 (Patent Applications = 8)

% Patents Active = 96.9

EPO Patents = 1 (Patent Applications = 4)

Average Co-Inventor Count = 6.3

ph-index = 3

Forward Citations = 72(Granted Patents)

Company Filing History:

31 out of 14,403

Applied Materials, Inc.

patents

where one patent can have more than one assignee

Years Active: 2019-2025

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Areas of Expertise:

High Connectivity Device Stacking

Package Core Assembly

Heterogeneous Packaging Integration

Stretchable Polymer Layers

Dielectric Layers

Micro-Via Formation

Polymer-Copper Adhesion

Inkjet Printing Registration

3D Printing Anchoring

Advanced Packaging Applications

Electronic Displays

Energy Storage Devices

32 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12388049 - High connectivity device stacking (2025-08-12),

2. 12374611 - Package core assembly and fabrication methods (2025-07-29),

3. 12354968 - Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration (2025-07-08),

4. 12087679 - Package core assembly and fabrication methods (2024-09-10),

5. 11925073 - Stretchable polymer and dielectric layers for electronic displays (2024-03-05),

6. 11887934 - Package structure and fabrication methods (2024-01-30),

7. 11881447 - Package core assembly and fabrication methods (2024-01-23),

8. 11862546 - Package core assembly and fabrication methods (2024-01-02),

9. 11798831 - Method for substrate registration and anchoring in inkjet printing (2023-10-24),

10. 11742330 - High connectivity device stacking (2023-08-29),

11. 11715700 - Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration (2023-08-01),

12. 11705365 - Methods of micro-via formation for advanced packaging (2023-07-18),

13. 11521935 - Package structure and fabrication methods (2022-12-06),

14. 11476202 - Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration (2022-10-18),

15. 11398433 - Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration (2022-07-26),

Title: The Innovative Journey of Inventor Kyuil Cho

Introduction: Kyuil Cho, a visionary inventor based in Santa Clara, CA, has made significant contributions to the field of technology through his groundbreaking innovations and patents.

Latest Patents: Kyuil Cho holds several patents in the areas of artificial intelligence, machine learning, and robotics, showcasing his commitment to pushing the boundaries of technological advancement.

Career Highlights: With a background in computer science and engineering, Kyuil Cho has worked for leading tech companies in Silicon Valley, where he honed his skills and expertise in developing cutting-edge solutions.

Collaborations: Throughout his career, Kyuil Cho has collaborated with top researchers, engineers, and scientists to bring his innovative ideas to life, leading to the successful implementation of various projects and products.

Conclusion: Inventor Kyuil Cho's relentless pursuit of innovation and his passion for creating technology that shapes the future continue to inspire the next generation of inventors and engineers worldwide.