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For the Inventor, By the Inventor

Santa Clara, CA, United States of America

Kyuil Cho

This inventor holds 32 USPTO granted patents and 8 published patent applications and 1 EPO patent, primarily in Advanced Packaging. Top assignee: Applied Materials, Inc.. Active years: 2019-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kyuil Cho. Retrieved from https://idiyas.com/inventor/kyuil-cho

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 32 

% Patents Active = 96.9

 

Average Co-Inventor Count = 6.3

ph-index = 3

Forward Citations = 72(Granted Patents)


Company Filing History:

goldMedal31 out of 14,454 
 
Applied Materials, Inc.
 patents
where one patent can have more than one assignee

Years Active: 2019-2025

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Areas of Expertise:
High Connectivity
Device Stacking
Heterogeneous Packaging
Substrate Fabrication
Polymer Layers
Micro-Via Formation
3D Printing
Inkjet Printing
Encapsulation
Redistribution Interconnect
Energy Storage
32 patents (USPTO):Explore Patents
1. 12388049 - High connectivity device stacking (2025-08-12),
2. 12374611 - Package core assembly and fabrication methods (2025-07-29),
3. 12354968 - Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration (2025-07-08),
4. 12087679 - Package core assembly and fabrication methods (2024-09-10),
5. 11925073 - Stretchable polymer and dielectric layers for electronic displays (2024-03-05),
6. 11887934 - Package structure and fabrication methods (2024-01-30),
7. 11881447 - Package core assembly and fabrication methods (2024-01-23),
8. 11862546 - Package core assembly and fabrication methods (2024-01-02),
9. 11798831 - Method for substrate registration and anchoring in inkjet printing (2023-10-24),
10. 11742330 - High connectivity device stacking (2023-08-29),
11. 11715700 - Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration (2023-08-01),
12. 11705365 - Methods of micro-via formation for advanced packaging (2023-07-18),
13. 11521935 - Package structure and fabrication methods (2022-12-06),
14. 11476202 - Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration (2022-10-18),
15. 11398433 - Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration (2022-07-26),

Title: The Innovative Journey of Inventor Kyuil Cho

Introduction: Kyuil Cho, a visionary inventor based in Santa Clara, CA, has made significant contributions to the field of technology through his groundbreaking innovations and patents.

Latest Patents: Kyuil Cho holds several patents in the areas of artificial intelligence, machine learning, and robotics, showcasing his commitment to pushing the boundaries of technological advancement.

Career Highlights: With a background in computer science and engineering, Kyuil Cho has worked for leading tech companies in Silicon Valley, where he honed his skills and expertise in developing cutting-edge solutions.

Collaborations: Throughout his career, Kyuil Cho has collaborated with top researchers, engineers, and scientists to bring his innovative ideas to life, leading to the successful implementation of various projects and products.

Conclusion: Inventor Kyuil Cho's relentless pursuit of innovation and his passion for creating technology that shapes the future continue to inspire the next generation of inventors and engineers worldwide.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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