The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 24, 2023

Filed:

May. 02, 2022
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Daihua Zhang, Los Altos, CA (US);

Hou T. Ng, Campbell, CA (US);

Nag B. Patibandla, Pleasanton, CA (US);

Sivapackia Ganapathiappan, Los Altos, CA (US);

Yingdong Luo, Newark, CA (US);

Kyuil Cho, Santa Clara, CA (US);

Han-Wen Chen, Cupertino, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/68 (2006.01); H01L 21/67 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/68 (2013.01); H01L 21/02288 (2013.01); H01L 21/6715 (2013.01);
Abstract

A method for printing on a substrate includes printing a support structure by printing a liquid precursor material and curing the liquid precursor material, positioning a substrate within the support structure, printing one or more anchors on the substrate and the support structure by printing and curing the liquid precursor material to secure the substrate to the support structure, and printing one or more device structures on the substrate while anchored by printing and curing the liquid precursor material.


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