Applied Materials, Inc.

Kyuil Cho

Han-Wen Chen

Steven Verhaverbeke

Giback Park

Vincent Dicaprio

Roman Gouk

Kurtis Leschkies

Giorgio Cellere

Diego Tonini

Chintan Buch

Guan Huei See

Hou Tee Ng

Sivapackia Ganapathiappan

Nag B Patibandla

Wei-Sheng Lei

Robert Jan Visser

Daihua Zhang

Yingdong Luo

Byung Sung Kwak

Jean Delmas

Jeffrey L Franklin

Bernhard Stonas

Tapash Chakraborty

Arvind Sundarrajan

Lizhong Sun

Byung-Sung Kwak

Prerna Sonthalia Goradia

Yu Gu

Boyi Fu

Colin Costano Neikirk

Prayudi Lianto

Miaojun Wang

Dimitrios Argyris

The present disclosure generally relates to stacked miniaturized electronic devices and methods of forming the same. More specifically, embodiments described herein relate to semiconductor device spacers and methods of forming the same. The semiconductor device spacers described herein may be utilized to form stacked semiconductor package assemblies, stacked PCB assemblies, and the like.

High connectivity device stacking

The present disclosure relates to semiconductor core assemblies and methods of forming the same. The semiconductor core assemblies described herein may be utilized to form semiconductor package assemblies, PCB assemblies, PCB spacer assemblies, chip carrier assemblies, intermediate carrier assemblies (e.g., for graphics cards), and the like. In one embodiment, a silicon substrate core is structured by direct laser patterning. One or more conductive interconnections are formed in the substrate core and one or more redistribution layers are formed on surfaces thereof. The silicon substrate core may thereafter be utilized as a core structure for a semiconductor package, PCB, PCB spacer, chip carrier, intermediate carrier, or the like.

Package core assembly and fabrication methods

The present disclosure relates to thin-form-factor reconstituted substrates and methods for forming the same. The reconstituted substrates described herein may be utilized to fabricate homogeneous or heterogeneous high-density 3D integrated devices. In one embodiment, a silicon substrate is structured by direct laser patterning to include one or more cavities and one or more vias. One or more semiconductor dies of the same or different types may be placed within the cavities and thereafter embedded in the substrate upon formation of an insulating layer thereon. One or more conductive interconnections are formed in the vias and may have contact points redistributed to desired surfaces of the reconstituted substrate. The reconstituted substrate may thereafter be integrated into a stacked 3D device.

Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration

A display device includes a display layer having a plurality of light-emitting diodes and an encapsulation layer covering a light-emitting side of the display layer. The encapsulation layer includes a plurality of first polymer projections on display layer, the plurality of first polymer projections having spaces therebetween, and a first dielectric layer conformally covering the plurality of first polymer projections and any exposed underlying surface in the spaces between the first polymer projections, the dielectric layer forming side walls along sides of the first polymer projections and defining wells in spaces between the side walls.

Stretchable polymer and dielectric layers for electronic displays

The present disclosure relates to methods and apparatus for forming a thin-form-factor semiconductor package. In one embodiment, a glass or silicon substrate is structured by micro-blasting or laser ablation to form structures for formation of interconnections therethrough. The substrate is thereafter utilized as a frame for forming a semiconductor package with embedded dies therein.

Package structure and fabrication methods

A method for printing on a substrate includes printing a support structure by printing a liquid precursor material and curing the liquid precursor material, positioning a substrate within the support structure, printing one or more anchors on the substrate and the support structure by printing and curing the liquid precursor material to secure the substrate to the support structure, and printing one or more device structures on the substrate while anchored by printing and curing the liquid precursor material.

Method for substrate registration and anchoring in inkjet printing

The present disclosure relates to micro-via structures for interconnects in advanced wafer level semiconductor packaging. The methods described herein enable the formation of high-quality, low-aspect-ratio micro-via structures with improved uniformity, thus facilitating thin and small-form-factor semiconductor devices having high I/O density with improved bandwidth and power.

Methods of micro-via formation for advanced packaging

Growing community of inventors

Santa Clara, CA, United States of America

Kyuil Cho