Company Filing History:

10 out of 641

Kla-tencor Technologies Corporation

patents

8 out of 1,787

Kla Tencor Corporation

patents

1 out of 2

Kla-tencor Coporation

patents

Years Active: 2002-2020

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19 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10724964 - Multi-sensor tiled camera with flexible electronics for wafer inspection (2020-07-28),

2. 9462206 - Integrated multi-channel analog front end and digitizer for high speed imaging applications (2016-10-04),

3. 8831767 - Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool (2014-09-09),

4. 8754972 - Integrated multi-channel analog front end and digitizer for high speed imaging applications (2014-06-17),

5. 8010222 - Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool (2011-08-30),

6. 7332438 - Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool (2008-02-19),

7. 7175503 - Methods and systems for determining a characteristic of polishing within a zone on a specimen from combined output signals of an eddy current device (2007-02-13),

8. 7096752 - Environmental damage reduction (2006-08-29),

9. 7070476 - In-situ metalization monitoring using eddy current measurements during the process for removing the film (2006-07-04),

10. 7052369 - Methods and systems for detecting a presence of blobs on a specimen during a polishing process (2006-05-30),

11. 7030018 - Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool (2006-04-18),

12. 6935922 - Methods and systems for generating a two-dimensional map of a characteristic at relative or absolute locations of measurement spots on a specimen during polishing (2005-08-30),

13. 6885190 - In-situ metalization monitoring using eddy current measurements during the process for removing the film (2005-04-26),

14. 6884146 - Systems and methods for characterizing a polishing process (2005-04-26),

15. 6866559 - Windows configurable to be coupled to a process tool or to be disposed within an opening in a polishing pad (2005-03-15),

Title: Innovations of Kurt Lehman: A Pioneer in Imaging Technology

Introduction: Kurt Lehman is a distinguished inventor based in Menlo Park, California, known for his remarkable contributions to the field of imaging technology. With a total of 19 patents to his name, he has significantly advanced the capabilities of semiconductor wafer inspection and high-speed imaging applications.

Latest Patents: Two of Kurt Lehman's latest innovations exemplify his expertise in the field. The first patent, titled "Multi-sensor tiled camera with flexible electronics for wafer inspection," features sensor units that can be disposed of in a support member. Each sensor unit consists of a folded flex board that includes a plurality of laminations and an aperture, with a sensor located over the aperture. This groundbreaking system can be utilized in broadband plasma inspection tools for semiconductor wafers.

The second recent patent, "Integrated multi-channel analog front end and digitizer for high-speed imaging applications," describes a module designed for high-speed image processing. This module integrates an image sensor that generates multiple analog outputs representing an image, alongside several high-density digital devices (HDDs) configured to process these outputs concurrently. Each HDD is equipped with an analog front end (AFE), an analog-to-digital converter (ADC), and a data formatting block, further optimizing signal integrity and achieving high data rates for inspection and metrology applications.

Career Highlights: Kurt Lehman has made significant contributions during his tenure at various organizations, notably at KLA-Tencor Technologies Corporation and KLA-Tencor Corporation. His innovative work in semiconductor inspection technologies has solidified his reputation as a leading inventor in the industry.

Collaborations: Throughout his career, Kurt has collaborated with prominent figures in the field, including Charles L. Chen and Ronald L. Allen. These collaborations have fostered creativity and the development of cutting-edge technologies in imaging and inspection systems.

Conclusion: Kurt Lehman's impactful innovations in imaging technology demonstrate his commitment to advancing semiconductor inspection methodologies. With 19 patents and a track record of collaboration with industry leaders, Lehman continues to inspire future developments within the fields of imaging technology and semiconductor processing.

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