The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2005
Filed:
Feb. 04, 2003
Kurt Lehman, Menlo Park, CA (US);
Charles Chen, Sunnyvale, CA (US);
Ronald L. Allen, San Jose, CA (US);
Robert Shinagawa, Cupertino, CA (US);
Anantha Sethuraman, Palo Alto, CA (US);
Christopher F. Bevis, Los Gatos, CA (US);
Thanassis Trikas, Redwood City, CA (US);
Haiguang Chen, Millbrae, CA (US);
Ching Ling Meng, Fremont, CA (US);
Kurt Lehman, Menlo Park, CA (US);
Charles Chen, Sunnyvale, CA (US);
Ronald L. Allen, San Jose, CA (US);
Robert Shinagawa, Cupertino, CA (US);
Anantha Sethuraman, Palo Alto, CA (US);
Christopher F. Bevis, Los Gatos, CA (US);
Thanassis Trikas, Redwood City, CA (US);
Haiguang Chen, Millbrae, CA (US);
Ching Ling Meng, Fremont, CA (US);
KLA-Tencor Technologies Corp., Milpitas, CA (US);
Abstract
Systems and methods for characterizing a polishing process are provided. One method includes scanning a specimen with two or more measurement devices during polishing. In one embodiment, the two or more measurement devices may include a reflectometer and a capacitance probe. In another embodiment, the two or more measurement devices may include an optical device and an eddy current device. An additional embodiment relates to a measurement device for scanning a specimen during polishing. The device includes a light source and a scanning assembly. The scanning assembly is configured to scan light from the light source across the specimen during polishing. Another measurement device includes a laser light source coupled to a first fiber optic bundle and a detector coupled to a second fiber optic bundle. An additional method includes scanning a specimen with different measurement devices during different steps of a polishing process.