Kuniaki Horie

This inventor holds 26 USPTO granted patents and 1 published patent application, primarily in Thin Film Deposition. Top assignee: Ebara Corporation. Active years: 1999-2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kuniaki Horie. Retrieved from https://idiyas.com/inventor/kuniaki-horie

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 26 (Patent Applications = 1)

% Patents Active = 57.7

Average Co-Inventor Count = 4.6

ph-index = 12

Forward Citations = 1,555(Granted Patents)

Location History:

Yamato, JP (1999 - 2002)
Kanagawa-ken, JP (2002)
Kanagawa, JP (2005)
Tokyo, JP (2002 - 2017)

Company Filing History:

26 out of 2,576

Ebara Corporation

patents

Years Active: 1999-2017

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Areas of Expertise:

Electrochemical Deposition

Thin Film

Sputtering Method

Substrate Holder

Particle Beam Irradiation

Vaporization System

Gas Injection Device

Liquid Delivery

Interconnection Formation

Coating Modification

Film Growth Apparatus

26 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9624596 - Electrochemical deposition method (2017-04-18),

2. 9593430 - Electrochemical deposition method (2017-03-14),

3. 9506162 - Electrochemical deposition method (2016-11-29),

4. 9388505 - Electrochemical deposition method (2016-07-12),

5. 8936705 - Electrochemical deposition apparatus (2015-01-20),

6. 8337680 - Substrate holder and plating apparatus (2012-12-25),

7. 7901551 - Substrate holder and plating apparatus (2011-03-08),

8. 7601248 - Substrate holder and plating apparatus (2009-10-13),

9. 6972256 - Method and apparatus for forming thin film of metal (2005-12-06),

10. 6921722 - Coating, modification and etching of substrate surface with particle beam irradiation of the same (2005-07-26),

11. 6780245 - Method and apparatus of producing thin film of metal or metal compound (2004-08-24),

12. 6730596 - Method of and apparatus for forming interconnection (2004-05-04),

13. 6517642 - Method and apparatus of producing thin film of metal or metal compound (2003-02-11),

14. 6488774 - Trap apparatus (2002-12-03),

15. 6458694 - High energy sputtering method for forming interconnects (2002-10-01),

Title: Kuniaki Horie - Pioneering Inventor from Tokyo, JP

Introduction: Kuniaki Horie is a renowned inventor hailing from Tokyo, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Kuniaki Horie holds several patents in the areas of robotics, artificial intelligence, and renewable energy, showcasing his continuous commitment to pushing the boundaries of technological advancement.

Career Highlights: With a career spanning over two decades, Kuniaki Horie has worked with leading tech companies in Japan, spearheading research and development projects that have led to significant technological breakthroughs.

Collaborations: Throughout his career, Kuniaki Horie has collaborated with top researchers, engineers, and scientists both locally and internationally, fostering a culture of innovation and knowledge sharing.

Conclusion: Kuniaki Horie's relentless pursuit of innovation and his passion for creating technology that makes a difference have solidified his reputation as a visionary inventor in the global tech community.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

1 patent pending: