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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9593430 B1

PDFFull Text
Date of Patent:
Mar. 14, 2017

Filed:

Jun. 13, 2016

Electrochemical deposition method

Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Junichiro Yoshioka, Tokyo, JP;

Kuniaki Horie, Tokyo, JP;

Yugang Guo, Tokyo, JP;

Satoshi Morikami, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:

Wenderoth, Lind & Ponack, L.L.P.

Primary Examiner:

Harry D Wilkins, III

Int. Cl.
CPC ...
C25D 17/00 (2006.01); C25D 7/12 (2006.01); H01L 21/687 (2006.01); H01L 21/683 (2006.01); H01L 21/288 (2006.01); H01L 23/00 (2006.01); C25D 17/06 (2006.01); C25D 21/12 (2006.01); H01L 21/67 (2006.01); C25D 17/08 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
C25D 17/001 (2013.01); C25D 7/12 (2013.01); C25D 17/004 (2013.01); C25D 17/005 (2013.01); C25D 17/06 (2013.01); C25D 17/08 (2013.01); C25D 21/12 (2013.01); H01L 21/2885 (2013.01); H01L 21/6723 (2013.01); H01L 21/67126 (2013.01); H01L 21/67253 (2013.01); H01L 21/687 (2013.01); H01L 21/6838 (2013.01); H01L 21/68707 (2013.01); H01L 21/68764 (2013.01); H01L 24/11 (2013.01); H01L 24/742 (2013.01); C25D 7/123 (2013.01); H01L 21/76879 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/13169 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01);
Abstract

The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.

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