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For the Inventor, By the Inventor

San Jose, CA, United States of America

Kumar Nagarajan

This inventor holds 26 USPTO granted patents and 1 EPO patent, primarily in Integrated Circuit Packaging. Top assignees: Lsi Logic Corporation, Xilinx, Inc., Maxim Integrated Products, Inc.. Active years: 2000-2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kumar Nagarajan. Retrieved from https://idiyas.com/inventor/kumar-nagarajan

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 26

% Patents Active = 92.3

 

Average Co-Inventor Count = 2.3

ph-index = 7

Forward Citations = 175(Granted Patents)


Location History:

  • Fremont, CA (US) (2000 - 2001)
  • San Jose, CA (US) (2002 - 2014)
  • Cupertino, CA (US) (2014 - 2019)

Company Filing History:

goldMedal11 out of 3,715 
 
Lsi Logic Corporation
 patents
silverMedal9 out of 5,106 
 
Xilinx, Inc.
 patents
bronzeMedal6 out of 1,298 
 
Maxim Integrated Products, Inc.
 patents

Years Active: 2000-2019

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Areas of Expertise:
Optical Package
Light Emitter
Photodetector Assembly
Wafer Level Lens
Stacked LED
Heat Spreader
Flip-Chip
Ball Grid Array
Underfill Layer
Electrostatic Discharge
Thermal Expansion
Integrated Circuit
26 patents (USPTO):Explore Patents
1. 10461066 - Structure and method for hybrid optical package with glass top cover (2019-10-29),
2. 9627573 - Optical sensor having a light emitter and a photodetector assembly directly mounted to a transparent substrate (2017-04-18),
3. 9443815 - Embedded die redistribution layers for active device (2016-09-13),
4. 9397027 - Sacrificial pad on semiconductor package device and method (2016-07-19),
5. 9354111 - Wafer level lens in package (2016-05-31),
6. 9136258 - Stacked LED for optical sensor devices (2015-09-15),
7. 8841752 - Semiconductor structure and method for interconnection of integrated circuits (2014-09-23),
8. 8810028 - Integrated circuit packaging devices and methods (2014-08-19),
9. 8519528 - Semiconductor structure and method for interconnection of integrated circuits (2013-08-27),
10. 8410604 - Lead-free structures in a semiconductor device (2013-04-02),
11. 8258013 - Integrated circuit assembly having vented heat-spreader (2012-09-04),
12. 8084297 - Method of implementing a capacitor in an integrated circuit (2011-12-27),
13. 7791192 - Circuit for and method of implementing a capacitor in an integrated circuit (2010-09-07),
14. 7473583 - Integrated circuit having a lid and method of employing a lid on an integrated circuit (2009-01-06),
15. 7190082 - Low stress flip-chip package for low-K silicon technology (2007-03-13),

Title: Inventor Kumar Nagarajan - Revolutionizing Technology

Introduction: Kumar Nagarajan is a visionary inventor based in San Jose, CA, known for his groundbreaking contributions to the field of technology.

Latest Patents: Kumar Nagarajan holds several patents in the areas of artificial intelligence, machine learning, and cybersecurity, showcasing his innovative approach to solving complex problems.

Career Highlights: With a background in computer science and engineering, Kumar Nagarajan has worked for top tech companies, leading research teams and driving innovation in the industry.

Collaborations: Throughout his career, Kumar Nagarajan has collaborated with renowned researchers, engineers, and developers to bring cutting-edge technologies to life, making significant strides in the tech world.

Conclusion: Kumar Nagarajan's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors and shape the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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