The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 13, 2007
Filed:
Mar. 24, 2003
Applicants:
Kumar Nagarajan, San Jose, CA (US);
Zafer Kutlu, Menlo Park, CA (US);
Inventors:
Kumar Nagarajan, San Jose, CA (US);
Zafer Kutlu, Menlo Park, CA (US);
Assignee:
LSI Logic Corporation, Milipitas, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract
An underfill includes a base material and a filler material added to the base material wherein the filler material constitutes a selected percentage by weight of the underfill to provide an optimum balance between interfacial die stress and solder bump strain for next generation, Cu, low-K silicon technology.