Location History:
- Kumamoto, JP (1996 - 2002)
- Kikuyo-Machi, JP (2002 - 2003)
- Kikuchi-gun, JP (2001 - 2004)
- Kumamoto-ken, JP (1997 - 2005)
Company Filing History:
Years Active: 1996-2005
Title: Inventor Spotlight: Koji Harada - Revolutionizing Substrate Processing Methods
Introduction:
In the world of innovations and patents, Koji Harada has emerged as a prolific inventor with a diverse range of expertise in substrate processing methods. Hailing from Kumamoto-ken, Japan, Harada has made significant contributions to the field with his 17 patents and groundbreaking inventions. Let's delve deeper into his latest patents and explore the companies he has worked with, as well as some of his noteworthy collaborators.
Latest Patents:
Koji Harada's most recent patents showcase his profound understanding of substrate processing techniques and his ability to address complex challenges with innovative solutions. One of his latest patents involves a substrate processing method that utilizes intermittent process gas supply/stop operations. The approach ensures that while the hydrophobic process progresses, the temperature of the gas contact portion of a wafer remains consistent, eliminating non-uniformity of the hydrophobic process on the front surface of the wafer.
Another noteworthy patent is his heat treatment unit, cooling unit, and cooling treatment method. This invention comprises a substrate cooling unit with a cooling plate that accommodates the substrate, a temperature adjusting element that regulates the cooling plate's temperature, and a temperature controller that dynamically adjusts the cooling temperature based on a transfer function. By incorporating a control parameter changing section, Harada's invention allows for precise temperature regulation during the cooling process.
Work Experience:
Koji Harada's professional journey has seen him contribute his expertise to industry giants, including Tokyo Electron Limited and Tokyo Electron Saga Limited. These companies are renowned for their cutting-edge technologies and advancements in the semiconductor and electronics sectors. Harada's association with these organizations indicates his involvement in projects at the forefront of substrate processing innovation.
Collaborators:
Collaboration is often instrumental in driving innovation forward, and Harada has had the opportunity to work alongside several notable colleagues. Among his accomplished coworkers are Jun Ookura and Sinichiro Izumi. Their combined expertise and shared passion for pushing the boundaries of substrate processing have likely played a crucial role in their successful inventions.
Conclusion:
Koji Harada's contributions to the field of substrate processing methods have exemplified his ingenuity and commitment to innovative solutions. With 17 patents to his name, his ability to address complex challenges and improve efficiency in various processes is evident. As Harada continues to push the boundaries of substrate processing, the industry can anticipate more groundbreaking inventions from this visionary inventor.
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