Hong Kong, China

Kin Yik Hung

USPTO Granted Patents = 6 

 

Average Co-Inventor Count = 3.9

ph-index = 1

Forward Citations = 46(Granted Patents)


Location History:

  • Kwai Chung, CN (2008)
  • Hong Kong, CN (2006 - 2019)

Company Filing History:


Years Active: 2006-2019

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6 patents (USPTO):Explore Patents

Title: Kin Yik Hung: Innovator in Die Bonding Technology

Introduction

Kin Yik Hung is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of die bonding technology, holding a total of 6 patents. His innovative designs have advanced the efficiency and effectiveness of die bonding processes in various applications.

Latest Patents

Among his latest patents is a "Die bonding apparatus comprising an inert gas environment." This invention features a first inert gas container with a lower concentration of inert gas and a second container with a higher concentration, both enclosed within the first. The apparatus includes a bond head located in the second container for receiving a die for bonding, and a third inert gas container where a substrate can be positioned for die bonding. The bond head is designed to move the die between two positions, facilitating the bonding process.

Another significant patent is the "Bond head for thermal compression die bonding." This invention includes a collet that supports a die during bonding and a bond head heater that heats the collet and die. The design incorporates a die vacuum suction hole to hold the collet and a collet vacuum suction hole to secure the die. Additionally, vacuum distribution channels ensure an even distribution of suction force across the collet's surface.

Career Highlights

Kin Yik Hung has worked with prominent companies in the industry, including ASM Assembly Automation Limited and ASM Technology Singapore Pte Ltd. His experience in these organizations has allowed him to refine his skills and contribute to cutting-edge technologies in die bonding.

Collaborations

Throughout his career, Kin has collaborated with talented individuals such as Yuk Cheung Au and Pak Kin Leung. These partnerships have fostered innovation and have been instrumental in the development of his patented technologies.

Conclusion

Kin Yik Hung is a distinguished inventor whose work in die bonding technology has made a lasting impact on the industry. His innovative patents and collaborations highlight his commitment to advancing technology in this field.

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