The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2016
Filed:
Jul. 30, 2012
Kin Yik Hung, Kwai Chung, HK;
Pak Kin Leung, Kwai Chung, HK;
Cheuk Wah Tang, Kwai Chung, HK;
Chi Ping Hung, Kwai Chung, HK;
Gary Peter Widdowson, Hong Kong, HK;
Kin Yik Hung, Kwai Chung, HK;
Pak Kin Leung, Kwai Chung, HK;
Cheuk Wah Tang, Kwai Chung, HK;
Chi Ping Hung, Kwai Chung, HK;
Gary Peter Widdowson, Hong Kong, HK;
ASM TECHNOLOGY SINGAPORE PTE LTD, Singapore, SG;
Abstract
A bond head for thermal compression die bonding comprises a collet operative to support a die on a first side of the collet during die bonding and a bond head heater located on a second side of the collet opposite to the first side for heating the collet and the die. A die vacuum suction hole on the bond head heater applies a vacuum suction force to hold the collet, and a collet vacuum suction hole on the bond head heater applies a vacuum suction force to hold the die. At least one vacuum distribution channel that is formed on the second side of the collet is in fluid communication with the collet vacuum suction hole and distributes the vacuum suction force across a surface of the second side of the collet for securing the collet.