Hong Kong, China

Chi Ping Hung


Average Co-Inventor Count = 4.4

ph-index = 1


Company Filing History:


Years Active: 2010-2016

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2 patents (USPTO):Explore Patents

Title: Chi Ping Hung: Innovator in Thermal Compression Die Bonding and Optical Systems

Introduction

Chi Ping Hung is a notable inventor based in Hong Kong, CN. He has made significant contributions to the fields of thermal compression die bonding and optical systems. With a total of 2 patents, his work showcases innovative solutions that enhance technology in these areas.

Latest Patents

One of Chi Ping Hung's latest patents is a bond head for thermal compression die bonding. This invention comprises a collet that supports a die on one side during the bonding process, while a bond head heater on the opposite side heats both the collet and the die. The design includes a die vacuum suction hole that applies a vacuum force to hold the collet, and a collet vacuum suction hole that secures the die. Additionally, vacuum distribution channels are integrated to ensure even distribution of the vacuum force across the collet's surface.

Another significant patent is an optical system having a selectable field for inspection. This system features multiple lenses with a main optical axis aligned with their centers. It includes a low magnification optical subsystem for viewing objects at a lower magnification and a high magnification optical subsystem for detailed inspection at a higher magnification. The high magnification subsystem allows for precise light transmission, enhancing the overall viewing experience.

Career Highlights

Chi Ping Hung has worked with reputable companies such as ASM Technology Singapore Pte Ltd and ASM Assembly Automation Limited. His experience in these organizations has contributed to his expertise in developing innovative technologies.

Collaborations

Throughout his career, Chi Ping Hung has collaborated with talented individuals, including Kin Yik Hung and Pak Kin Leung. These partnerships have fostered a creative environment that has led to the development of groundbreaking inventions.

Conclusion

Chi Ping Hung's contributions to thermal compression die bonding and optical systems reflect his innovative spirit and dedication to advancing technology. His patents demonstrate a commitment to solving complex challenges in these fields.

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