Cheuk Wah Tang

Title: Cheuk Wah Tang: Innovator in Semiconductor Technology

Introduction

Cheuk Wah Tang is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His innovative designs focus on improving the efficiency and effectiveness of semiconductor bonding processes.

Latest Patents

One of his latest patents is a "Rapid cooling system for a bond head heater." This invention features a bond head that includes an insulation block, a heater plate, and a collet for holding a semiconductor device. The heater plate is designed to heat the semiconductor device, while a flow generation plate directs cooling gas onto the heater plate to facilitate rapid cooling. Another significant patent is the "Bond head for thermal compression die bonding." This bond head comprises a collet that supports a die during bonding and a heater that heats both the collet and the die. It includes vacuum suction holes to secure the die and collet, ensuring a reliable bonding process.

Career Highlights

Cheuk Wah Tang has worked with reputable companies such as ASM Assembly Automation Limited and ASM Technology Singapore Pte Ltd. His experience in these organizations has allowed him to refine his skills and contribute to advancements in semiconductor technology.

Collaborations

Throughout his career, Cheuk Wah Tang has collaborated with talented individuals, including Gary Peter Widdowson and Pak Kin Leung. These collaborations have fostered innovation and the development of cutting-edge technologies in the semiconductor industry.

Conclusion

Cheuk Wah Tang's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor. His work continues to impact the industry positively, paving the way for future innovations.