Asm Technology Singapore Pte Ltd

Asm Assembly Automation Limited

Cheuk Wah Tang

Gary Peter Widdowson

Kin Yik Hung

Pak Kin Leung

Srikanth Narasimalu

Wai Chuen Gan

Man Wai Chan

Chi Ping Hung

Chor Fai Wong

Lu Ma

Kai Chiu Wu

Wei Ling Chan

A bond head comprises an insulation block, a heater plate attached to the insulation block and a collet located on the heater plate for holding a semiconductor device. The heater plate is operative to heat the semiconductor device that is held by the collet. A flow generation plate that is detachably mounted between the insulation block and the heater plate is configured to direct cooling gas from the insulation block onto the heater plate so as to rapidly cool the heater plate.

Rapid cooling system for a bond head heater

A bond head for thermal compression die bonding comprises a collet operative to support a die on a first side of the collet during die bonding and a bond head heater located on a second side of the collet opposite to the first side for heating the collet and the die. A die vacuum suction hole on the bond head heater applies a vacuum suction force to hold the collet, and a collet vacuum suction hole on the bond head heater applies a vacuum suction force to hold the die. At least one vacuum distribution channel that is formed on the second side of the collet is in fluid communication with the collet vacuum suction hole and distributes the vacuum suction force across a surface of the second side of the collet for securing the collet.

Bond head for thermal compression die bonding

A system for maintaining thermal stability of a motion stage driven by a motor comprises a motion current generator operative to produce a motion current to drive the motion stage to move and a thermal current generator operative to produce a thermal current to dissipate heat in the motion stage for controlling a temperature of the motion stage without producing corresponding movement of the motion stage. A summation controller is operative to combine the motion current with the thermal current, and to produce a combined current output to the motor.

System for maintaining thermal stability of a motion stage

An oven is provided for curing or reflowing compounds on objects, such as lead frames or other substrates. The oven comprises a heating chamber, a heating assembly mounted in thermal communication with the heating chamber to provide heat thereto, and a support assembly for supporting the object in the heating chamber for heating. The heating assembly and support assembly are configured to be movable relative to one another for controllably positioning the object at variable distances with respect to the heating assembly. Heating of the object according to a heating profile can thus be achieved by controlled heating of the object at different temperatures by positioning the object at different distances with respect to the heating assembly during the heating process although there is a single heating zone.

Oven for controlled heating of compounds at varying temperatures

Growing community of inventors

Hong Kong, China

Cheuk Wah Tang