Pak Kin Leung

Title: The Innovative Contributions of Pak Kin Leung

Introduction

Pak Kin Leung is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of semiconductor technology, holding a total of 5 patents. His work focuses on enhancing the efficiency and effectiveness of bond head cooling apparatuses.

Latest Patents

Among his latest patents is the "Bond Head Cooling Apparatus." This innovative cooling apparatus is designed for a bond head that holds a semiconductor die. It features a collet and a heater to heat the semiconductor die. The cooling apparatus includes a dielectric liquid supply and a gas supply. A spray nozzle, located next to the heater's surface, sprays a liquid-gas mixture to cool the heater effectively. Another significant patent is the "Atomization Mechanism for Cooling a Bond Head." This mechanism comprises an atomization module and a conduit. The atomization module receives gas and liquid to form an atomized spray, which is then conveyed to the bond head for cooling.

Career Highlights

Pak Kin Leung has worked with reputable companies such as ASM Technology Singapore Pte Ltd and ASM Assembly Automation Limited. His experience in these organizations has contributed to his expertise in semiconductor technology and innovation.

Collaborations

He has collaborated with notable coworkers, including Gary Peter Widdowson and Yi Kei Law. Their combined efforts have further advanced the field of semiconductor technology.

Conclusion

Pak Kin Leung's innovative patents and career achievements highlight his significant contributions to the semiconductor industry. His work continues to influence advancements in technology and cooling mechanisms.