The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2020
Filed:
Oct. 27, 2014
Yi Kei Law, Kwai Chung, HK;
Pak Kin Leung, Kwai Chung, HK;
Chuek Wah Tang, Kwai Chung, HK;
Gary Peter Widdowson, Kwai Chung, HK;
Yi Kei Law, Kwai Chung, HK;
Pak Kin Leung, Kwai Chung, HK;
Chuek Wah Tang, Kwai Chung, HK;
Gary Peter Widdowson, Kwai Chung, HK;
ASM TECHNOLOGY SINGAPORE PTE LTD, Singapore, SG;
Abstract
A cooling apparatus is provided for a bond head which has a collet to hold a semiconductor die and a heater to heat the semiconductor die held by the collet. The cooling apparatus includes a dielectric liquid supply for supplying a dielectric liquid and a gas supply for supplying a gas. A spray nozzle is located next to a surface of the heater, and is connected to both the dielectric liquid supply and the gas supply. In order to cool the heater, the spray nozzle sprays a liquid-gas mixture of the dielectric liquid and the gas towards the surface of the heater.