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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10312214 B1

PDFFull Text
Date of Patent:
Jun. 04, 2019

Filed:

Sep. 08, 2016

Atomization mechanism for cooling a bond head

Applicant:

Asm Technology Singapore Pte. Ltd., Singapore, SG;

Inventors:

Yi Kei Law, Kwai Chung, HK;

Chuek Wah Tang, Kwai Chung, HK;

Pak Kin Leung, Kwai Chung, HK;

Gary Peter Widdowson, Hong Kong, HK;

Wing Chiu Lai, Tuen Mun, HK;

Kin Fung Yu, Hong Kong, HK;

Jiang Wen Deng, Kwai Chung, HK;

Assignee:

ASM TECHNOLOGY SINGAPORE PTE LTD, Singapore, SG;

Attorney:

Ostrolenk Faber LLP

Primary Examiner:

Erin B Saad

Int. Cl.
CPC ...
B23K 3/00 (2006.01); H01L 23/00 (2006.01); B05B 12/08 (2006.01); B05B 7/04 (2006.01); B23K 3/04 (2006.01); B23K 3/08 (2006.01); B23K 1/00 (2006.01); B23K 1/20 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
H01L 24/75 (2013.01); B05B 7/0416 (2013.01); B05B 12/087 (2013.01); B23K 1/0016 (2013.01); B23K 1/20 (2013.01); B23K 3/04 (2013.01); B23K 3/085 (2013.01); B23K 2101/42 (2018.08); H01L 2224/75502 (2013.01);
Abstract

An atomization mechanism for cooling a bond head comprises an atomization module and a conduit. In use, the atomization module receives gas and liquid from a gas supply and a liquid supply respectively to form an atomized spray and the conduit conveys the atomized spray from the atomization module to a spray inlet located at the bond head to receive the atomized spray into the bond head for cooling the bond head.

Find Patent Forward Citations

Law, Yi. (2019). Atomization mechanism for cooling a bond head (U.S. Patent No. 10312214). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10312214

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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