Company Filing History:
Years Active: 2019
Title: Innovations by Kin Fung Yu
Introduction
Kin Fung Yu is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on enhancing the efficiency and functionality of bonding apparatuses used in semiconductor devices.
Latest Patents
One of his latest patents is an "Atomization mechanism for cooling a bond head." This invention comprises an atomization module and a conduit. In use, the atomization module receives gas and liquid from a gas supply and a liquid supply respectively to form an atomized spray. The conduit then conveys the atomized spray from the atomization module to a spray inlet located at the bond head, allowing for effective cooling of the bond head.
Another significant patent is the "Pick arm comprising a winged part for a bonding apparatus." This pick arm is designed for a pick and place apparatus used in semiconductor devices. It features first and second ends along a longitudinal axis, with a pick tool located at the first end for picking up semiconductor devices. The pick arm also includes a winged part that extends in a direction transverse to the longitudinal axis, which has a sloping surface inclined between the top and bottom portions of the winged part.
Career Highlights
Kin Fung Yu is currently employed at Asm Technology Singapore Pte Ltd, where he continues to innovate in the semiconductor industry. His work has been instrumental in developing advanced technologies that improve the performance of semiconductor manufacturing processes.
Collaborations
He has collaborated with notable coworkers such as Gary Peter Widdowson and Wing Chiu Lai, contributing to various projects that enhance the capabilities of semiconductor devices.
Conclusion
Kin Fung Yu's contributions to the field of semiconductor technology through his innovative patents demonstrate his expertise and commitment to advancing the industry. His work continues to influence the development of efficient bonding apparatuses, making a significant impact on semiconductor manufacturing.