Asm Technology Singapore Pte Ltd

Kin Fung Yu

Gary Peter Widdowson

Wing Chiu Lai

Ying Liu

Kai Siu Lam

Pak Kin Leung

Jiang Wen Deng

Chuek Wah Tang

Yi Kei Law

Yu Xing Cao

An atomization mechanism for cooling a bond head comprises an atomization module and a conduit. In use, the atomization module receives gas and liquid from a gas supply and a liquid supply respectively to form an atomized spray and the conduit conveys the atomized spray from the atomization module to a spray inlet located at the bond head to receive the atomized spray into the bond head for cooling the bond head.

Atomization mechanism for cooling a bond head

A pick arm for a pick and place apparatus for semiconductor devices, the pick arm comprising first and second ends along a longitudinal axis of the pick arm, and a pick tool located at the first end of the pick arm for picking up semiconductor devices. The pick arm further comprises a winged part extending in a direction transverse to the longitudinal axis between the first and second ends of the pick arm, wherein the winged part comprising a sloping surface. The sloping surface is inclined between a top portion and a bottom portion of the winged part such that the sloping surface is nearer to the longitudinal axis at the top portion than at the bottom portion of the winged part.

Pick arm comprising a winged part for a bonding apparatus

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Hong Kong, China

Kin Fung Yu