Asm Technology Singapore Pte Ltd

Asm Assembly Automation Limited

Kin Yik Hung

Yuk Cheung Au

Pak Kin Leung

Cheuk Wah Tang

Gary Peter Widdowson

Srikanth Narasimalu

Man Wai Chan

Chi Fung Chan

Hing Leung Marchy Li

Siu Wing Lau

Wing Chiu Lai

Ming Wai Kelvin Ng

Chi Ping Hung

Wing Chiu Derek Lai

Cheuk Wah Chester Tang

Kai Chiu Wu

Wei Ling Chan

Leo Man Lee

Sai Yuen Go

Wai Lam

Man Leo Lee

A die bonding apparatus comprising a first inert gas container having a first inert gas concentration, and a second inert gas container having a second inert gas concentration enclosed within the first inert gas container. The second inert gas concentration is higher than the first inert gas concentration. The die bonding apparatus further comprises a bond head located in the second inert gas container for receiving a die for bonding, and a third inert gas container having an inert gas environment that is separate from the first and second inert gas containers and where a substrate is locatable for die bonding. The bond head is operative to move the die between a first position within the second inert container and a second position within the third inert gas container to bond the die onto the substrate located in the third inert gas container.

Die bonding apparatus comprising an inert gas environment

A bond head for thermal compression die bonding comprises a collet operative to support a die on a first side of the collet during die bonding and a bond head heater located on a second side of the collet opposite to the first side for heating the collet and the die. A die vacuum suction hole on the bond head heater applies a vacuum suction force to hold the collet, and a collet vacuum suction hole on the bond head heater applies a vacuum suction force to hold the die. At least one vacuum distribution channel that is formed on the second side of the collet is in fluid communication with the collet vacuum suction hole and distributes the vacuum suction force across a surface of the second side of the collet for securing the collet.

Bond head for thermal compression die bonding

An electronic device bonding apparatus comprises a flip arm for picking up an electronic device, the flip arm being operative to invert an orientation of the electronic device. A collet tool which contacts the electronic device and secures it to the flip arm is detachably mountable onto the flip arm, and a bond arm may pick up the electronic device from the collet tool to bond the electronic device to a bonding surface. Additionally, a tool changer module is operative to detach the collet tool from the flip arm and to mount another collet tool onto the flip arm.

Flip arm module for a bonding apparatus incorporating changeable collet tools

A linear motor comprising a coil assembly and a magnet assembly is provided with a cooling apparatus which comprises a segmented air knife assembly. The segmented air knife assembly has a plurality of slot openings distributed along its length which is coupled to the linear motor and it is operative to discharge cooling air into a gap between the coil assembly and magnet assembly in a discharge direction. An inclined surface extends from the plurality of slot openings and slopes at an obtuse angle away from the discharge direction of the cooling air. Each slot opening is individually configured to discharge the cooling air in the discharge direction at a sufficient velocity so as to entrain atmospheric air along the inclined surface to amplify the cooling air that is so discharged.

Apparatus for generating amplified cooling air flows

An oven is provided for curing or reflowing compounds on objects, such as lead frames or other substrates. The oven comprises a heating chamber, a heating assembly mounted in thermal communication with the heating chamber to provide heat thereto, and a support assembly for supporting the object in the heating chamber for heating. The heating assembly and support assembly are configured to be movable relative to one another for controllably positioning the object at variable distances with respect to the heating assembly. Heating of the object according to a heating profile can thus be achieved by controlled heating of the object at different temperatures by positioning the object at different distances with respect to the heating assembly during the heating process although there is a single heating zone.

Oven for controlled heating of compounds at varying temperatures

The invention provides an ultrasonic transducer assembly for a bonding apparatus, comprising a bonding tool mounted to an amplifying horn secured between first and second ultrasonic-generating means. A method of forming a transducer for a bonding apparatus is also provided, comprising the steps of providing an amplifying horn, securing first and second ultrasonic-generating means to the amplifying horn such that the amplifying horn is located between said first and second ultrasonic-generating means and mounting a bonding tool to the amplifying horn.

Ultrasonic transducer assembly

Growing community of inventors

Hong Kong, China

Kin Yik Hung