The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2019
Filed:
May. 20, 2016
Asm Technology Singapore Pte Ltd, Singapore, SG;
Siu Wing Lau, Kwai Chung, HK;
Kin Yik Hung, Kwai Chung, HK;
Yuk Cheung Au, Kwai Chung, HK;
Wing Chiu Lai, Kwai Chung, HK;
Leo Man Lee, Kwai Chung, HK;
Sai Yuen Go, Kwai Chung, HK;
ASM TECHNOLOGY SINGAPORE PTE LTD, Singapore, SG;
Abstract
A die bonding apparatus comprising a first inert gas container having a first inert gas concentration, and a second inert gas container having a second inert gas concentration enclosed within the first inert gas container. The second inert gas concentration is higher than the first inert gas concentration. The die bonding apparatus further comprises a bond head located in the second inert gas container for receiving a die for bonding, and a third inert gas container having an inert gas environment that is separate from the first and second inert gas containers and where a substrate is locatable for die bonding. The bond head is operative to move the die between a first position within the second inert container and a second position within the third inert gas container to bond the die onto the substrate located in the third inert gas container.