This inventor holds 4 USPTO granted patents and 1 published patent application and 1 EPO patent. Top assignees: Asm Assembly Automation Limited, Asm Technology Singapore Pte Ltd. Active years: 2003-2019.
Company Filing History:
3 out of 124 
1 out of 234 
Years Active: 2003-2019
Title: Siu Wing Lau: Innovator in Die Bonding Technology
Introduction
Siu Wing Lau is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of die bonding technology, holding a total of 4 patents. His innovative approaches have advanced the efficiency and effectiveness of die bonding processes.
Latest Patents
One of his latest patents is a "Die bonding apparatus comprising an inert gas environment." This invention features a first inert gas container with a lower concentration of inert gas and a second container with a higher concentration, both enclosed within the first. The apparatus includes a bond head located in the second container for receiving a die for bonding, along with a third inert gas container where a substrate can be placed for die bonding. The bond head is designed to move the die between two positions for optimal bonding.
Another significant patent is the "Die bonding process incorporating infrared vision system." This method involves aligning a die while it is held with a circuit pattern facing away from an infrared light source. Infrared light is projected onto the opposite side of the die, allowing for the detection and capture of an image of the reflected light. This captured image is then used to determine the alignment of the die.
Career Highlights
Siu Wing Lau has worked with prominent companies in the industry, including ASM Assembly Automation Limited and ASM Technology Singapore Pte Ltd. His experience in these organizations has contributed to his expertise in die bonding technology and innovation.
Collaborations
Throughout his career, Siu Wing Lau has collaborated with talented individuals such as Yuk Cheung Au and Ran Shi Wang. These collaborations have likely enriched his work and led to further advancements in his field.
Conclusion
Siu Wing Lau is a distinguished inventor whose work in die bonding technology has resulted in multiple patents and significant advancements in the industry. His innovative solutions continue to influence the field and inspire future developments.