The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2003
Filed:
Nov. 27, 2000
Applicant:
Inventors:
Siu Wing Lau, Kwai Chung, HK;
Yuk Cheung Au, Kwai Chung, HK;
Assignee:
ASM Assembly Automation Ltd., , HK;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B65G 4/907 ;
U.S. Cl.
CPC ...
B65G 4/907 ;
Abstract
Die bonding apparatus is provided in which in order to move a target die to a pick-up position, a wafer table is moved by rotation and along one linear axis. This reduces the footprint of the apparatus in comparison to prior art apparatus in which this movement is accomplished by movement along two orthogonal linear axes. In an embodiment of the invention, however, movement along a second orthogonal liner axis may also be provided whereby a user may select the method of moving a target die to the pick-up position.