The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2014
Filed:
May. 04, 2011
Applicants:
Chi Fung Chan, Hong Kong, CN;
Kin Yik Hung, Hong Kong, CN;
Inventors:
Chi Fung Chan, Hong Kong, CN;
Kin Yik Hung, Hong Kong, CN;
Assignee:
ASM Technology Singapore Pte. Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 37/00 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67144 (2013.01);
Abstract
An electronic device bonding apparatus comprises a flip arm for picking up an electronic device, the flip arm being operative to invert an orientation of the electronic device. A collet tool which contacts the electronic device and secures it to the flip arm is detachably mountable onto the flip arm, and a bond arm may pick up the electronic device from the collet tool to bond the electronic device to a bonding surface. Additionally, a tool changer module is operative to detach the collet tool from the flip arm and to mount another collet tool onto the flip arm.