Chi Fung Chan

Title: Innovations of Chi Fung Chan

Introduction

Chi Fung Chan is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of electronic component handling, holding a total of 4 patents. His work focuses on improving the efficiency and effectiveness of electronic device bonding and handling apparatuses.

Latest Patents

One of his latest patents is an "Apparatus and method for adjustment of a handling device for handling electronic components." This invention discloses an apparatus designed for handling electronic components, featuring a rotary device and an imaging device that captures images to derive offsets for alignment. The apparatus includes multiple pick heads that hold electronic components and a fiducial mark that indicates the arrangement of these components.

Another significant patent is the "Flip arm module for a bonding apparatus incorporating changeable collet tools." This electronic device bonding apparatus includes a flip arm that can invert the orientation of an electronic device. It features a detachable collet tool that secures the device to the flip arm, allowing for efficient bonding to a surface.

Career Highlights

Chi Fung Chan has worked with reputable companies such as ASM Assembly Automation Limited and ASM Technology Singapore Pte Ltd. His experience in these organizations has contributed to his expertise in the field of electronic component handling and bonding technologies.

Collaborations

Throughout his career, Chi Fung Chan has collaborated with professionals like Chi Wah Cheng and Ping Chun Chong. These collaborations have likely enriched his work and led to innovative solutions in the industry.

Conclusion

Chi Fung Chan's contributions to the field of electronic component handling and bonding are noteworthy. His innovative patents and career experiences reflect his dedication to advancing technology in this area.