The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2006
Filed:
Jun. 03, 2003
Hing Leung Marchy LI, Hong Kong, CN;
Kin Yik Hung, Hong Kong, CN;
Ming Wai Kelvin NG, Hong Kong, CN;
Hing Leung Marchy Li, Hong Kong, CN;
Kin Yik Hung, Hong Kong, CN;
Ming Wai Kelvin Ng, Hong Kong, CN;
ASM Assembly Automation Ltd., Hong Kong, HK;
Abstract
The invention provides an ultrasonic transducer assembly for a bonding apparatus, comprising a bonding tool mounted to an amplifying horn secured between first and second ultrasonic-generating means. A method of forming a transducer for a bonding apparatus is also provided, comprising the steps of providing an amplifying horn, securing first and second ultrasonic-generating means to the amplifying horn such that the amplifying horn is located between said first and second ultrasonic-generating means and mounting a bonding tool to the amplifying horn.