Ming Wai Kelvin Ng

Title: The Innovations of Ming Wai Kelvin Ng

Introduction

Ming Wai Kelvin Ng is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of bonding technology, holding a total of 2 patents. His work focuses on enhancing the efficiency and precision of bonding tools used in various applications.

Latest Patents

Ming Wai Kelvin Ng's latest patents include an "Apparatus and method for alignment of a bonding tool." This invention provides a sophisticated apparatus and method for aligning a bonding tool, utilizing a force sensor with multiple sensing sections. Each section is designed to detect the force exerted by the bonding tool, allowing for precise alignment. Another significant patent is the "Ultrasonic transducer assembly," which details an ultrasonic transducer assembly for a bonding apparatus. This assembly features a bonding tool mounted to an amplifying horn, positioned between two ultrasonic-generating means, enhancing the bonding process.

Career Highlights

Ming Wai Kelvin Ng is currently employed at Asm Assembly Automation Limited, where he applies his expertise in bonding technology. His innovative approaches have contributed to the advancement of bonding tools and methods, making a notable impact in the industry.

Collaborations

Ming Wai Kelvin Ng has collaborated with several talented individuals, including Hing Leung Marchy Li and Kin Yik Hung. These collaborations have fostered a creative environment that encourages innovation and the development of new technologies.

Conclusion

Ming Wai Kelvin Ng's contributions to bonding technology through his patents and collaborations highlight his role as a significant inventor in the field. His work continues to influence advancements in bonding methods and tools, showcasing the importance of innovation in technology.