Kenji Hanada

Title: Kenji Hanada: Innovator in Semiconductor Manufacturing

Introduction

Kenji Hanada is a prominent inventor hailing from Kodaira, Japan, known for his significant contributions to the field of electronics and semiconductor technology. With a total of four patents to his name, his work has helped improve manufacturing processes and enhance the reliability of electronic devices.

Latest Patents

Among his recent innovations is the patent titled "Electronic device and manufacturing method of the same." This invention presents a technique that enhances the reliability of modules utilizing printed circuit boards (PCBs) as their substrate. The method involves solder connections of various components, including single-chip components, integrated chip components, and semiconductor chip ICs utilizing lead-free solder. These connections are achieved through heat treatment at temperatures below 280°C using a heat block. For semiconductor chip ICs, solder connections are performed using high-melting point solder at temperatures exceeding 280°C with a hot jet application. This groundbreaking approach prevents several issues such as damage to the PCB from excess heat, including burning of solder resist and peeling of prepreg from the core material, ultimately ensuring that semiconductor chip ICs can be mounted to PCBs with enhanced connection strength.

Career Highlights

Kenji has held pivotal roles in leading companies, notably Renesas Technology Corporation and Renesas Eastern Japan Semiconductor, Inc. His experience in these firms has significantly influenced his innovative capabilities, allowing him to develop advanced techniques in semiconductor manufacturing.

Collaborations

Throughout his career, Kenji has collaborated with notable colleagues, including Masaki Nakanishi and Kunio Shigemura. These partnerships have enriched his projects, fostering an environment of shared knowledge and innovation in the semiconductor industry.

Conclusion

Kenji Hanada’s inventive spirit and technological prowess have made a lasting impact on electronic device reliability and semiconductor manufacturing methods. His contributions continue to influence advancements in this crucial field, setting a benchmark for future innovations.