The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2006
Filed:
Aug. 29, 2003
Kenji Hanada, Kodaira, JP;
Masaki Nakanishi, Tokyo, JP;
Tomoo Matsuzawa, Tokyo, JP;
Koji Shida, Takasaki, JP;
Kazutoshi Takashima, Miyota, JP;
Kenji Hanada, Kodaira, JP;
Masaki Nakanishi, Tokyo, JP;
Tomoo Matsuzawa, Tokyo, JP;
Koji Shida, Takasaki, JP;
Kazutoshi Takashima, Miyota, JP;
Renesas Technology Corporation, Tokyo, JP;
Renesas Eastern Japan Semiconductor, Inc., Tokyo, JP;
Abstract
A sensor chip and a lens mount accommodating therein the sensor chip are mounted on a surface of a wiring substrate and a lens holder accommodating a lens therein is coupled with the lens mount. On a rear surface of the wiring substrate, a logic chip, a memory chip and a passive component are mounted and they are sealed with a seal resin. An electrode pad of the sensor chip is electrically connected to an electrode on the surface of the wiring substrate via a bonding wire but a stud bump is also formed on the electrode at the surface of the wiring substrate and this stud bump is connected with the bonding wire. On the surface of the wiring substrate, a flexible substrate is bonded with an anisotropic conductive film and a bonding material. When a camera module is to be manufactured, the surface side of the wiring substrate is assembled after the rear surface side of the wiring substrate is assembled.