Renesas Technology Corp.

Renesas Eastern Japan Semiconductor, Inc.

Renesas Electronics Corporation

Kenji Hanada

Masaki Nakanishi

Takafumi Nishita

Seiichi Tomoi

Kunio Shigemura

Masayoshi Shinoda

Tomoo Matsuzawa

Koji Shida

Akio Ishizu

Kazutoshi Takashima

A technique that makes it possible to enhance the reliability of a module using PCB as its module substrate is provided. Solder connection of a single-chip component, an integrated chip component, and a semiconductor chip ICby Pb-free solder is carried out by heat treatment at a temperature below 280&#xb0; C. using a heat block. Solder connection of a semiconductor chip ICby high-melting point solder is carried out by heat treatment at a temperature of 280&#xb0; C. or higher using a hot jet. Thus, the semiconductor chip ICcan be solder connected to PCBusing high-melting point solder without the following troubles: damage to the PCBdue to heat, for example, burning of solder resist; and peeling of prepreg from a core material. Therefore, the semiconductor chip ICcan be mounted over the PCBwith high connection strength.

Electronic device and manufacturing method of the same

In a method of manufacturing a camera module having a CMOS image sensor, a semiconductor chip to serve as a light sensor is mounted on a optical-component-mounting face of a wiring substrate mother board and, after bonding wires are connected to the semiconductor chip, a lens barrel is joined to the wiring substrate mother board so as to cover the semiconductor chip. A position adjustment pin and a through hole are provided on the lens barrel and the wiring substrate mother board respectively outside a junction face between the lens barrel and the wiring substrate mother board to be used for adjusting the position of the lens barrel with respect to the wiring substrate mother board by inserting the position adjustment pin into the through hole.

Manufacturing method of solid-state image sensing device

A sensor chip and a lens mount accommodating therein the sensor chip are mounted on a surface of a wiring substrate and a lens holder accommodating a lens therein is coupled with the lens mount. On a rear surface of the wiring substrate, a logic chip, a memory chip and a passive component are mounted and they are sealed with a seal resin. An electrode pad of the sensor chip is electrically connected to an electrode on the surface of the wiring substrate via a bonding wire but a stud bump is also formed on the electrode at the surface of the wiring substrate and this stud bump is connected with the bonding wire. On the surface of the wiring substrate, a flexible substrate is bonded with an anisotropic conductive film and a bonding material. When a camera module is to be manufactured, the surface side of the wiring substrate is assembled after the rear surface side of the wiring substrate is assembled.

Growing community of inventors

Kodaira, Japan

Kenji Hanada