The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 2008
Filed:
Nov. 18, 2005
Kunio Shigemura, Kodaira, JP;
Kenji Hanada, Kodaira, JP;
Masaki Nakanishi, Tokyo, JP;
Takafumi Nishita, Iruma, JP;
Masayoshi Shinoda, Kumagaya, JP;
Seiichi Tomoi, Saku, JP;
Kunio Shigemura, Kodaira, JP;
Kenji Hanada, Kodaira, JP;
Masaki Nakanishi, Tokyo, JP;
Takafumi Nishita, Iruma, JP;
Masayoshi Shinoda, Kumagaya, JP;
Seiichi Tomoi, Saku, JP;
Renesas Technology Corp., Tokyo, JP;
Abstract
A technique that makes it possible to enhance the reliability of a module using PCB as its module substrate is provided. Solder connection of a single-chip component, an integrated chip component, and a semiconductor chip ICby Pb-free solder is carried out by heat treatment at a temperature below 280° C. using a heat block. Solder connection of a semiconductor chip ICby high-melting point solder is carried out by heat treatment at a temperature of 280° C. or higher using a hot jet. Thus, the semiconductor chip ICcan be solder connected to PCBusing high-melting point solder without the following troubles: damage to the PCBdue to heat, for example, burning of solder resist; and peeling of prepreg from a core material. Therefore, the semiconductor chip ICcan be mounted over the PCBwith high connection strength.