Seiichi Tomoi

Title: The Innovations of Seiichi Tomoi

Introduction

Seiichi Tomoi is a notable inventor based in Saku, Japan, recognized for his contributions to electronic device technology. With a total of six patents to his name, he has made significant advancements in the reliability and efficiency of electronic modules.

Latest Patents

One of his latest patents is focused on an electronic device and its manufacturing method. This technique enhances the reliability of a module using printed circuit board (PCB) as its substrate. The patent describes a method for solder connection of a single-chip component, an integrated chip component, and a semiconductor chip IC using lead-free solder, which is achieved through heat treatment at temperatures below 280°C with a heat block. Additionally, it details the solder connection of a semiconductor chip IC using high-melting point solder, which is treated at temperatures of 280°C or higher with a hot jet. This innovation prevents damage to the PCB, such as burning of solder resist and peeling of prepreg from the core material, allowing for high connection strength when mounting semiconductor chip ICs over PCBs.

Career Highlights

Throughout his career, Seiichi Tomoi has worked with prominent companies in the technology sector, including Renesas Technology Corporation and Renesas Electronics Corporation. His work has significantly impacted the development of electronic devices, particularly in enhancing their reliability and performance.

Collaborations

Seiichi has collaborated with notable colleagues such as Yasuo Osone and Chiko Yorita, contributing to various projects that have advanced the field of electronics.

Conclusion

Seiichi Tomoi's innovative work in electronic devices has led to significant advancements in the industry. His patents reflect a commitment to improving the reliability and efficiency of electronic modules, making him a key figure in the field of technology.