The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 21, 2006
Filed:
Apr. 08, 2003
Yasuyuki Nakajima, Tachikawa, JP;
Toshiaki Morita, Hitachi, JP;
Tomoo Matsuzawa, Tokyo, JP;
Seiichi Tomoi, Kodaira, JP;
Naoki Kawanabe, Kodaira, JP;
Yasuyuki Nakajima, Tachikawa, JP;
Toshiaki Morita, Hitachi, JP;
Tomoo Matsuzawa, Tokyo, JP;
Seiichi Tomoi, Kodaira, JP;
Naoki Kawanabe, Kodaira, JP;
Renesas Technology Corp., Tokyo, JP;
Abstract
Provided is a semiconductor device comprising a first metal film formed above a semiconductor chip, a ball portion formed over said first metal film and made of a second metal, and an alloy layer of said first metal and said second metal which alloy layer is formed between said first metal film and said ball portion, wherein said alloy layer reaches the bottom of said first metal film, and said ball portion is covered with a resin; and a manufacturing method thereof. The present invention makes it possible to improve adhesion between the bonding pad portion and ball portion of a bonding wire over an interconnect, thereby improving the reliability of the semiconductor device.