The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 30, 2007

Filed:

Sep. 11, 2003
Applicants:

Kenji Hanada, Kodaira, JP;

Akio Ishizu, Maruko, JP;

Inventors:

Kenji Hanada, Kodaira, JP;

Akio Ishizu, Maruko, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

In a method of manufacturing a camera module having a CMOS image sensor, a semiconductor chip to serve as a light sensor is mounted on a optical-component-mounting face of a wiring substrate mother board and, after bonding wires are connected to the semiconductor chip, a lens barrel is joined to the wiring substrate mother board so as to cover the semiconductor chip. A position adjustment pin and a through hole are provided on the lens barrel and the wiring substrate mother board respectively outside a junction face between the lens barrel and the wiring substrate mother board to be used for adjusting the position of the lens barrel with respect to the wiring substrate mother board by inserting the position adjustment pin into the through hole.


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