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Ken-Yu Chang

This inventor holds 37 USPTO granted patents and 20 published patent applications, primarily in Semiconductor Manufacturing. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2014-2026.

USPTO Granted Patents = 37 (Patent Applications = 20)

% Patents Active = 91.9

Average Co-Inventor Count = 5.3

ph-index = 2

Forward Citations = 30(Granted Patents)

Company Filing History:

36 out of 42,679

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

1 out of 437

Taiwan Semiconductor Manufacturing Co., Ltd.

patents

Years Active: 2014-2026

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Areas of Expertise:

Conductive Structures

Interconnects

Contact Formation

Chemical Vapor Deposition

3DIC

Metallization Process

Hybrid Diffusion Barrier

Fin Structure

Copper Layer

Liner-Free Structures

Source Drain Contacts

Dummy Shoulder Structures

37 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12588268 - Liner-free conductive structures (2026-03-24),

2. 12433006 - Semiconductor device with conductive liners over silicide structures and method of making the semiconductor device (2025-09-30),

3. 12400853 - Method of forming conductive feature including cleaning step (2025-08-26),

4. 12362198 - Interface tool and methods of operation (2025-07-15),

5. 12327788 - Gate to source drain interconnects (2025-06-10),

6. 12300539 - Source/drain contact formation methods and devices (2025-05-13),

7. 12252783 - Chemical vapor deposition for uniform tungsten growth (2025-03-18),

8. 12249566 - 3DIC with gap-fill structures and the method of manufacturing the same (2025-03-11),

9. 12191199 - Contact metallization process (2025-01-07),

10. 12148659 - Contact conductive feature formation and structure (2024-11-19),

11. 12057397 - Capping layer for liner-free conductive structures (2024-08-06),

12. 12020981 - Conductive feature formation and structure (2024-06-25),

13. 11955329 - Method of forming conductive feature including cleaning step (2024-04-09),

14. 11929314 - Interconnect structures including a fin structure and a metal cap (2024-03-12),

15. 11817384 - Interconnect structure and manufacturing method for the same (2023-11-14),

Title: Ken-Yu Chang: Innovator from Hsinchu

Introduction: Ken-Yu Chang is a renowned inventor hailing from Hsinchu, Taiwan. His innovative spirit and dedication to technological advancements have made him a prominent figure in the world of patents and inventions.

Latest Patents: Ken-Yu Chang holds several patents in various fields, including electronics, telecommunications, and renewable energy. His recent patents focus on sustainable energy solutions and cutting-edge communication technologies.

Career Highlights: With a background in engineering and a passion for problem-solving, Ken-Yu Chang has had a successful career marked by groundbreaking inventions. His contributions have significantly impacted industries such as semiconductor manufacturing and wireless communications.

Collaborations: Throughout his career, Ken-Yu Chang has collaborated with leading research institutions, universities, and tech companies to bring his inventions to life. His collaborative efforts have led to the development of innovative products that have shaped the modern technological landscape.

Conclusion: Ken-Yu Chang's relentless pursuit of innovation and his commitment to pushing the boundaries of technology have established him as a visionary inventor. His work continues to inspire future generations of inventors and engineers to think creatively and strive for excellence in their pursuits.

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