Ogaki, Japan

Keisuke Shimizu

This inventor holds 21 USPTO granted patents and 6 published patent applications, primarily in Wiring Substrate Technology. Top assignees: Ibiden Company Limited, Ibiden Corporation. Active years: 2012-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Keisuke Shimizu. Retrieved from https://idiyas.com/inventor/keisuke-shimizu-29gphoya

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 21 

% Patents Active = 90.5

Average Co-Inventor Count = 2.1

ph-index = 4

Forward Citations = 43(Granted Patents)


Location History:

  • Gifu, JP (2013)
  • Ogaki, JP (2012 - 2019)

Company Filing History:


Years Active: 2012-2026

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Areas of Expertise:
Wiring Substrate
Semiconductor Package
Printed Wiring Board
Multilayer Wiring Board
Electronic Component
Manufacturing Method
Wiring Board
Cavity Design
Capacitor Section
Built-In Component
21 patents (USPTO):Explore Patents

Title: The Innovative Mind of Keisuke Shimizu: A Semiconductor Pioneer

Introduction: Keisuke Shimizu, a prominent inventor hailing from Ogaki, Japan, has made significant contributions to the field of semiconductor technology. With an impressive portfolio of 17 patents, he has played a pivotal role in advancing innovations that enhance electronic devices' performance and efficiency.

Latest Patents: Among his latest contributions are two notable patents related to semiconductor packages. The first patent describes a semiconductor package that features a printed wiring board, where a logic integrated circuit is mounted on one side. This innovative design includes a connector and an optical element capable of converting optical signals to electrical signals, positioned strategically on opposite sides of the board. Additionally, a path within the board electrically connects the logic IC and the optical element, along with an optical waveguide that facilitates the optical connection between the connector and the optical element.

The second patent further refines this technology, detailing a semiconductor package where the optical element is housed within the printed wiring board. This includes an optical waveguide that bridges the optical element to the connector while ensuring a minimal electrical path between the logic IC and the optical element, measuring no more than 1 mm in length.

Career Highlights: Keisuke Shimizu is currently employed at Ibiden Company Limited, a leader in electronics and semiconductor manufacturing. His work not only reflects his inventive spirit but also signifies his commitment to the advancement of semiconductor technology which is foundational to many modern electronic applications.

Collaborations: Throughout his career, Shimizu has collaborated with esteemed colleagues such as Yuichi Nakamura and Yoichiro Kawamura. These partnerships have fostered a creative environment leading to breakthrough innovations and have reinforced the collaborative nature of modern technological advancements.

Conclusion: Keisuke Shimizu's contributions to semiconductor technology are a testament to his innovative mindset and technical expertise. His patents and collaborative efforts will likely continue to influence the electronics industry, paving the way for future advancements in this crucial field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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