The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 2015

Filed:

Mar. 08, 2012
Applicant:

Keisuke Shimizu, Ogaki, JP;

Inventor:

Keisuke Shimizu, Ogaki, JP;

Assignee:

IBIDEN CO., LTD., Ogaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); H05K 1/18 (2006.01); H01L 23/00 (2006.01); H05K 3/30 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/188 (2013.01); H01L 24/18 (2013.01); H01L 2924/07802 (2013.01); H05K 3/305 (2013.01); H05K 3/4661 (2013.01); H05K 3/4697 (2013.01); Y10T 29/49124 (2015.01);
Abstract

A wiring board with a built-in electronic component includes a substrate having an accommodation portion, an electronic component having an electrode and accommodated in the accommodation portion of the substrate, a conductive layer having a planar conductive pattern formed over the electrode of the electronic component, and one or more via conductors connecting the planar conductive pattern of the conductive layer and the electrode of the electronic component. The electrode of the electronic component has a portion which faces the planar conductive pattern of the conductive layer and which has a plurality of outer edges facing outward with respect to a surface of the electronic component on which the portion of the electrode is formed, and the planar conductive pattern of the conductive layer has a portion positioned directly over one or more of the outer edges of the electrode of the electronic component.


Find Patent Forward Citations

Shimizu, Keisuke. (2015). Wiring board with built-in electronic component and method for manufacturing the same (U.S. Patent No. 9113575). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9113575

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…