The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2016
Filed:
Jul. 30, 2014
Applicant:
Ibiden Co., Ltd., Ogaki, JP;
Inventors:
Assignee:
IBIDEN CO., LTD., Ogaki, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H01L 23/00 (2006.01); H05K 1/18 (2006.01); H05K 3/46 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/83 (2013.01); H05K 1/187 (2013.01); H05K 3/4682 (2013.01); H01L 2224/27464 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83192 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/14 (2013.01); H05K 3/0097 (2013.01); H05K 2201/068 (2013.01); H05K 2203/0156 (2013.01); H05K 2203/1536 (2013.01); Y10T 29/302 (2015.01);
Abstract
A printed wiring board includes a first insulation layer, an electronic component built into the first insulation layer, a second insulation layer having a via conductor and formed on a first surface of the first insulation layer, and a conductive film formed on the first insulation layer on the opposite side with respect to the first surface of the first insulation layer such that the conductive film is positioned to face a back surface of the electronic component. The first insulation layer has a coefficient of thermal expansion which is set higher than a coefficient of thermal expansion of the second insulation layer.